Reasons for poor tin on pcb board_

Automotive lighting PCB sales,BGA circuit board Merchant,Circuit board patch Vendor-Shenzhen VEC Technology Co., Ltd.

Tel: +86-755-29662580

Email: sales@victoriapcb.com

中

current position: Home 》 News 》 Industry News

Reasons for poor tin on pcb board

source:Industry News release time:2022-07-25 Article author:yu Popular:pcb

　　 Reasons for poor tin on pcb board(图1)

　　Poor tinning on the pcb board is generally related to the cleanliness of the surface of the PCB empty board. If there is no pollution, there will be basically no poor tinning. Second, the poor flux and temperature when tinning are used. Then the common electrical tin defects of printed circuit boards are mainly reflected in the following points:

　　1. There are particulate impurities in the plating layer of the pcb board, or there are polishing particles left on the surface of the circuit during the manufacturing process of the substrate.

　　2. The tin surface of the substrate or parts is oxidized and the copper surface is dark.

　　3. There are flakes on the pcb board that cannot be tinned, and there are particulate impurities in the plating on the board surface.

　　4. There are grease, impurities and other debris on the pcb board surface, or there is residual silicone oil.

　　5. The high-potential coating is rough, and there is a phenomenon of burning board. There are sheets on the PCB surface that cannot be tinned.

　　6. The coating on one side is complete, the coating on the other side is poor, and the low-potential hole has obvious bright edge phenomenon.

　　7. The edge of the low-potential hole has obvious bright edge phenomenon, the high-potential coating is rough, and there is a phenomenon of burning board.

　　8. Sufficient temperature or time is not guaranteed during the soldering process, or the flux is not used correctly.

　　9. The low-potential large area cannot be plated with tin, the surface of the board is slightly dark red or red, one side of the coating is complete, and the other side is poorly coated.

　　The reasons for poor tinning of pcb circuit boards are mainly reflected in the following points:

　　1. Too few anodes and uneven distribution.

　　2. Tin light agent is out of balance in small or excessive amounts.

　　3. There is some residual film or organic matter before plating.

　　4. The current density is too large and the plating solution is not filtered enough.

　　5. The composition of the bath potion is out of balance, the current density is too small, and the electroplating time is too short.

　　6. The anode is too long, the current density is too large, the local wire density of the pattern is too thin, and the light agent is out of balance.

Read recommendations:

Aluminum substrate (double-sided)

Laminate copper-based PCB after 4L (sample)

Six-layer Immersion Gold Board (BGA)

SMT circuit board

Previous:Dimensional stability of inner core board of multilayer board (PCB circuit board) Back to list Next:Poor tin on pcb board.BGA circuit board factory

Popular recommended products

High frequency PCB

Six-layer Immersion Gold Board (BGA)

Six-layer Immersion Gold Board (BGA)

Silver oil perforated plate (double-sided)

Display board (six layers)

Mobile phone template (six layers)

Six-layer Immersion Gold Board (BGA)

Computer card board (four layers)

High frequency PCB

Six-layer Immersion Gold Board (BGA)

Six-layer Immersion Gold Board (BGA)

High frequency PCB

Six-layer Immersion Gold Board (BGA)

Single-sided double-layer AL base PCB

Six-layer Immersion Gold Board (BGA)

Six-layer Immersion Gold Board (BGA)

Network communication board (sixth floor)

Single copper base PCB

Six-layer Immersion Gold Board (BGA)

Aluminum substrate (double-sided)

Laminate copper-based PCB after 4L (sample)

High frequency PCB

Six-layer Immersion Gold Board (BGA)

DIP plugin

Six-layer Immersion Gold Board (BGA)

SMT stickers

SMT stickers

Six-layer Immersion Gold Board (BGA)

Six-layer Immersion Gold Board (BGA)

Mobile phone board

DIP plugin

Six-layer Immersion Gold Board (BGA)

Six-layer Immersion Gold Board (BGA)

Mobile phone board

Related Information

Composition of PCB

What is the difference between PCB and PCBA

PCB usage tips

Why do the circuit boards are green

How to clean the aluminum substrate?

Maintenance of Chemical Copper Plating Solution on PCB Board

single-sided PCB board and double-sided PCB board

PCB board production process flow

PCB CTI level

Via technology in circuit board factory.Automotive Electronics PCB

The role of FPC flexible circuit board solder mask

Detailed explanation of PCB board sampling production process

pcb v-cut depth standard

Multilayer Printed Circuit Board.What is the eq of PCB

The relationship between PCB safety distance and voltage

SMT surface mount processing.Hybrid circuit board PCB

PCB enterprises should pay attention to SMT matters.Electronic components PCB

PCB - the core building block of electronic products.Automotive Electronics PCB

PCB - the bridge and link of the electronic world

How to define high-frequency and high-precision circuit boards.Industrial Electronics PCB

USB PCB interface layout and wiring requirements

Electrolytic capacitor PCB.Steps for using PCB pins

Automotive ElectronicWhat aspects should be considered when processing and manufacturing PCB boards?

Electrolytic capaciWhat is the difference between a gold-plated circuit board and a gold-plated one?

When grinding PCB boards, attention should be paid to.Oscillator (belonging to crystal) PCB

Industrial Electronics PCB!What precautions should be taken when copying and grinding PCB boards

Do you know who is more suitable for LED direct display, regarding the difference between PCB board

Aluminum electrolytic capacitor PCB.What are the standards for selecting PCB boards

Surface Mount Technology (SMT) Phase PCB

Oscillator (belonging to crystal) PCB.The main functions of PCB board