source:Industry News release time:2022-04-07 Article author:sznbone Popular:pcb
In order to achieve the expected effect of copper plating, circuit board manufacturers must pay attention to the following issues:
1. According to the location of the PCB, for PCBs with multiple grounds such as SGND, AGND, GND, etc., the copper shall be independently covered according to the main "ground" of the board surface. Separate digital ground and analog ground from copper injection, and thicken the corresponding power connections before copper injection: 5.0V, 3.3V, etc.
2. Connect a single point to another ground through a 0 ohm resistor, magnetic bead or inductor.
3. The crystal oscillator in the copper foil circuit near the crystal oscillator is a high-frequency radiation source. The crystal oscillator is surrounded by copper foil to separate the crystal oscillator shell.
4. Island (deadzone) problem, if you think it is too big, define and add a ground via.
5. The ground wire should be treated in the same way when wiring, and the ground wire should be well routed when wiring.
6. It is best not to have sharp edges on the substrate. Because from an electromagnetic point of view, this constitutes a transmitting antenna! There will always be an impact elsewhere, but it is best to use the edge of the arc, regardless of size.
7. Do not pour copper into the interlayer opening of the multilayer board.
8. The metal inside the device, such as metal radiators, metal reinforcement strips, etc., must be "well grounded".
9. The heat dissipation metal block of the three-terminal regulator must be well grounded. The ground insulation strip near the crystal oscillator must be well grounded. In short: when solving the copper grounding problem on the PCB, there should be "the advantages outweigh the disadvantages." It can reduce the return area of the signal line and reduce the electromagnetic interference of the signal to the outside world.
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