source:Industry News release time:2022-09-13 Article author:yu Popular:pcb
1. Classification according to the distribution of printed circuit boards
According to the approximate distribution of printed circuits, the printed circuit boards (Shenzhen Circuit Board Factory) can be divided into single-sided PCB boards, double-sided circuit boards, and PCB multi-layer circuit boards.
Single-sided PCB board
The single-sided PCB board is on an insulating substrate with a thickness of 0.2-5mm, and only one surface is covered with copper foil, and a printed circuit is formed on the substrate by printing and etching. The single-sided PCB board is simple to manufacture and easy to assemble. It is suitable for one-place circuit requirements, such as radios, televisions, etc.; it is not suitable for occasions requiring high assembly density or complex circuits.
Double-sided circuit board
Computers, electronic instruments and meters, etc. Since the wiring density of the printed circuit of the double-sided circuit board is higher than that of the single-sided circuit board, the volume of the equipment can be reduced.
PCB multilayer circuit board/circuit board
A printed board with more than 3 layers of printed circuits printed on an insulating substrate is called a multi-layer board. It is composed of several layers of thin single-sided or double-sided circuit boards, and its thickness is generally 1.2-2.5mm. In order to lead out the circuit sandwiched between the insulating substrates, the holes for mounting components on the (Shenzhen Circuit Board Factory) PCB multilayer circuit board need to be metallized, that is, the inner surface of the small holes is coated with an effective metal layer to make it sandwiched between the insulating substrates. The printed circuit is turned on.
1. A shielding layer is added to reduce the signal distortion of the circuit;
2. Reduce the welding points of components and reduce the failure rate;
3. Used in conjunction with integrated circuits, the whole machine can be miniaturized and the weight of the whole machine can be reduced;
4. Improve the wiring density, reduce the spacing of components, and shorten the signal transmission path;
5. The grounding heat dissipation layer is introduced, which can reduce local overheating and improve the reliability of the whole machine.
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