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Detailed explanation of circuit board manufacturing process and precautions

source:Industry News release time:2022-04-08 Article author:sznbone Popular:pcb

  

Detailed explanation of circuit board manufacturing process and precautions(图1)

  First-class production comes from first-class design, which is inseparable from the cooperation of your design. Engineers, please design according to the detailed explanation of the conventional production process.

  Detailed explanation of relevant design parameters:

  1. Via vias (commonly known as conductive holes)

  1. Minimum aperture: 0.2mm (8mil)

  2. The minimum via hole (VIA) diameter is not less than 0.2mm (8mil), the single side of the pad should not be less than 6mil (0.153mm), preferably larger than 8mil (0.2mm), but it is not limited. This point is very important, and the design must be considered .

  3. The via hole (VIA) hole-to-hole spacing (hole edge to hole edge) cannot be less than: 6 mil preferably greater than 8 mil. This point is very important, and the design must be considered.

  4. The spacing from the pad to the outline is 0.508mm (20mil).

  2. Line

  1. Minimum line spacing: 3mil (0.075mm). The minimum line spacing is line to line, and the distance from line to pad is not less than 6mil. From the production point of view, the bigger the better, the general routine is 10mil. Of course, under the condition of the design, the bigger the better. This point is very important. must be considered

  2. Minimum line width: 3mil (0.075mm). That is to say, if the line width is less than 6mil, it will not be able to produce, (the minimum line width and line spacing of the inner layer of the multi-layer circuit board is 8MIL) If the design conditions permit, the larger the design, the better, the larger the line width, the better the production of our circuit board factory, The higher the yield, the general design routine is about 10mil. This point is very important, and the design must be considered

  3. The spacing from the line to the outline line is 0.508mm (20mil)

  3. PAD pad (the so-called plug-in hole (PTH))

  1. The outer ring of the plug-in hole (PTH) pad should not be less than 0.2mm (8mil) on one side. Of course, the bigger the better, this is very important, and the design must be considered.

  2. The distance between the plug-in hole (PTH) and the hole (the edge of the hole to the edge of the hole) cannot be less than: 0.3mm. Of course, the bigger the better. This point is very important, and the design must be considered.

  3. The size of the plug-in hole depends on your components, but it must be larger than your component pins. It is recommended to be larger than at least 0.2mm or more, that is, the component pins of 0.6. You must design at least 0.8 to prevent processing. Tolerances make insertion difficult.

  4. The spacing from the pad to the outline is 0.508mm (20mil).

  4. Anti-welding

  1. The plug-in hole opens the window, and the single side of the SMD window cannot be less than 0.1mm (4mil).

  5. Characters (the design of the characters directly affects the production, whether the characters are clear or not is very related to the character design).

  1. The character width cannot be less than 0.153mm (6mil), and the character height cannot be less than 0.811mm (32mil). The relationship between the width and height ratio is preferably 5. That is to say, the character width is 0.2mm and the character height is 1mm. kind.

  6. Non-metallized slot holes, the minimum spacing of the slot holes is not less than 1.6mm, otherwise it will greatly increase the difficulty of milling.

  Seven, make-up

  1. There is no gap in the imposition, and there is a gap in the imposition. The imposition gap of the gap imposition should not be less than 1.6 (the thickness of the plate is 1.6) mm, otherwise it will greatly increase the difficulty of edge milling, and the size of the imposition work board is different depending on the equipment. , The gap of the gapless imposition is about 0.5mm and the process edge cannot be less than 5mm.


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