1. The hole attribute in the double-sided circuit board file PADS should select the through hole attribute (Through), and the blind buried hole attribute (Partial) cannot be selected, and the drilling file cannot be generated, which will lead to missing drilling.

　　2. Do not add slots in the PADS design with the components, because GERBER cannot be generated normally, in order to avoid the slot, please add the slot in DrillDrawing.

　　3. The PADS is paved with copper, and the circuit board manufacturer uses the Hatch method. After the customer's original file is moved, it must be re-paved with copper to save (using Flood to pave copper) to avoid short circuits.

　　Double-sided bonding circuit board proofing production

　　2. Documents about PROTEL99SE and DXP design

　　1. The solder mask of the circuit board manufacturer is based on the Soldermask layer. If the solder paste layer (Paste layer) needs to be made, and the multi-layer solder mask window cannot generate GERBER, please move to the solder mask layer.

　　2. Do not lock the outline in Protel99SE, and GERBER cannot be generated normally.

　　3. Do not select the KEEPOUT option in the DXP file, the outline and other components will be screened, and GERBER cannot be generated.

　　4. Please pay attention to the design of the front and back of these two documents. In principle, the top layer should be designed with positive characters, and the bottom layer should be designed as reverse characters. The circuit board manufacturer superimposes the board from the top layer to the bottom layer. Special attention should be paid to single-chip boards, and do not mirror images at will!

　　3. Other matters needing attention

　　1. The shape (such as circuit board frame, slot hole, V-CUT) must be placed on the KEEPOUT layer or the mechanical layer, and cannot be placed on other layers, such as the silk screen layer and the circuit layer. All grooves or holes that need to be mechanically formed should be placed on the first floor as much as possible to avoid leakage grooves or holes.

　　2. If the shapes of the mechanical layer and the KEEPOUT layer are inconsistent, please make special instructions. In addition, the shape must be given an effective shape. If there is an inner groove, the line segment of the outer shape of the board at the intersection with the inner groove needs to be deleted to avoid leakage. Slots, slots and holes designed on the mechanical layer and the KEEPOUT layer are generally made of copper-free holes (copper should be removed when making film). If it needs to be processed into metal holes, please make special remarks.

　　3. With three software designs, please pay special attention to whether the button position needs to be exposed to copper.

　　4. When placing an order for the gold finger circuit board, please note whether it needs to be chamfered.

　　5. The safest way to do metallized slots is to put together multiple pads, which will definitely not go wrong.

　　6. For GERBER files, please check whether there are few layers in the files. Generally, manufacturers will make them directly according to the GERBER files.

　　7. Under normal circumstances, gerber uses the following naming methods:

　　Component surface circuit: gtl Component surface solder mask: gts

　　Component surface character: gto welding surface line: gbl

　　Welding surface solder mask: gbs Welding surface character: gbo

　　Appearance: gko hole drawing: gdd

　　Drilling: dll

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