source:Industry News release time:2022-03-09 Article author:sznbone Popular:pcb
1. The process flow of single-sided circuit board is blanking and edging → drilling → outer layer graphics → (full board gold plating) → etching → inspection → silk screen solder mask → (hot air leveling) → silk screen characters → shape processing → testing → inspection.
2. The process flow of double-sided circuit board tin spraying board cutting edge grinding → drilling → copper sinking thickening → outer layer graphics → tin plating, etching and tin removal → secondary drilling → inspection → silk screen solder mask → gold-plated plug → hot air Leveling→screen printing characters→shape processing→testing→inspection.
3. The nickel-gold plating process of double-sided circuit boards is blanking and edging → drilling → copper sinking and thickening → outer layer graphics → nickel plating, gold removal and etching → secondary drilling → inspection → silk screen solder mask → silk screen characters → Shape processing → testing → inspection.
4. The process flow of multi-layer circuit board spray tin plate is cutting edge grinding → drilling positioning hole → inner layer pattern → inner layer etching → inspection → blackening → lamination → drilling → copper sinking thickening → outer layer pattern → tin plating , Etching and tin removal → secondary drilling → inspection → silk screen solder mask → gold-plated plug → hot air leveling → silk screen characters → shape processing → testing → inspection.
5. The process flow of the multi-layer circuit board immersion nickel gold plate is blanking and edging → drilling positioning holes → inner layer graphics → inner layer etching → inspection → blackening → lamination → drilling → immersion copper thickening → outer layer graphics → plating Tin, etching and tin removal → secondary drilling → inspection → silk screen solder mask → chemical immersion nickel gold → silk screen characters → shape processing → testing → inspection.
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