The role of blind vias is to conduct left and right, so as to ensure the reliability of the circuit board! Blind vias are distributed in some layers, and buried vias are distributed in the middle layer, through holes are distributed in all layers, and blind vias generally return They are all made by LASER laser (laser) drilling machine, while buried holes and through holes are generally made by mechanical drilling.

　　In the non-through-via technology, the application of blind vias and buried vias can greatly reduce the size and quality of the circuit board, reduce the number of layers, improve electromagnetic compatibility, increase the characteristics of electronic products, reduce costs, and also make design work. Easier and faster. In traditional circuit board design and processing, through-holes present many problems. First of all, they occupy a large amount of effective space, and secondly, a large number of through holes are densely packed in one place, which also causes huge obstacles to the inner layer routing of multi-layer circuit boards. These through holes occupy the space required for routing, and they densely pass through the power supply and wiring. The surface of the ground layer will also destroy the impedance characteristics of the power ground layer, making the power ground layer ineffective. And conventional mechanical drilling will be 20 times the workload of using non-penetrating hole technology.

　　In circuit board design, although the size of pads and vias has been gradually reduced, if the thickness of the board layer is not proportionally reduced, the aspect ratio of the vias will increase, and the increase in the aspect ratio of the vias will reduce reliability. . With the maturity of advanced laser drilling technology and plasma dry etching technology, it is possible to apply non-penetrating small blind holes and small buried holes. If the hole diameter of these non-penetrating holes is 0.3mm, the parasitic parameters brought by them are The original conventional hole is about 1/10, which improves the reliability of the circuit board.

　　Due to the use of non-through-hole technology, there will be few large vias on the circuit board, which can provide more space for wiring. The remaining space can be used for large area shielding to improve EMI/RFI performance. At the same time, more remaining space can also be used for the inner layer to partially shield the device and key network cables, so that it has the best electrical performance. The use of non-through vias makes it easier to fan out device pins, making it easy to route high-density pin devices (such as BGA packaged devices), shortening the wiring length, and meeting high-speed circuit timing requirements.

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